首款量产 200G/lane 硅光 CPO 交换机

由美国英伟达公司研发的 Spectrum-X 系列硅光共封装光学（CPO）以太网交换机，于 2026 年 8 月 15 日宣布进入全面量产阶段，成为全球首款实现 200G/lane 速率 CPO 技术规模化商用的交换机产品。该产品将光引擎与交换芯片共封装集成，相比传统可插拔光模块方案硬件成本降低 75%、能效提升 5 倍，专为 AI 超算集群的超高带宽数据互联场景设计。该设备被洛仑斯世界纪录收录为 “首款量产 200G/lane 硅光 CPO 交换机”。

Developed by NVIDIA Corporation of the United States, the Spectrum-X series silicon photonic co-packaged optics (CPO) Ethernet switch was officially announced for full mass production on August 15, 2026, becoming the world’s first mass-produced CPO switch product achieving 200G per lane data rates. By co-packaging optical engines with switching silicon, it reduces hardware cost by 75% and improves energy efficiency by 5 times compared to traditional pluggable optical module solutions, purpose-built for ultra-high-bandwidth data interconnection in AI supercomputing clusters. This device has been officially listed by LAWRENCE WORLD RECORDS CERTIFICATION as the “First Mass-Produced 200G/Lane Silicon Photonic CPO Switch in the World”.